Spin Coating


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Overview

Spin coating is the preferred method for application of thin, uniform films to flat substrates. An excess amount of polymer solution is placed on the substrate. The substrate is then rotated at high speed in order to spread the fluid by centrifugal force. Rotation is continued for some time, with fluid being spun off the edges of the substrate, until the desired film thickness is achieved. The solvent is usually volatile, providing for its simultaneous evaporation.

Process Schematic

References

A good reference on spin coating is:
W. Flack, D. Soong, A. Bell, and D. Hess, "A mathematical model for spin coating polymer resists," J. Appl. Phys., 56, 1199 (1984).
An excellent treatment of spin coating of a non-volatile Newtonian liquid can be found in:
S. Middleman and A.K. Hochberg, Process Engineering Analysis in Semiconductor Device Fabrication, McGraw-Hill, p. 313 (1993)

Suppliers of Spin Coaters

Laurell Technologies
Speedline Technologies
tok

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